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In addition to shock testing, several component suppliers also perform drop testing. For handheld products in particular, some suppliers prefer to perform board level drop testing instead. Details of the drop test method are outlined in JESD22-B111.41 Several component suppliers perform vibration testing in addition to shock testing to simulate shipping conditions. The design of the carrier tray or chassis in which the PWB is installed could significantly impact the reliability of printed circuit board assemblies (PCBAs). If the resonant frequency of the PCBA matches that of the chassis, and the mode shapes corresponding to the resonant frequency are such that they induce a strain above the critical solder joint failure strain, brittle fracture can occur. Accelerometers and strain gages should be used to characterize both mode shapes and strains in the PWB assemblies mounted on carrier trays or in chassis. The chassis design should be optimized to ensure that the strains that might impact the PCBAs are minimized, especially at the critical locations.Ways to do this include adding stiffeners, frames, and struts in the chassis at critical, high-strain locations. Finally, an additional way to mitigate shipping failures is to use shock indicators in the shipped product. A typical shock indicator changes color if the applied G values exceed a preset threshold. The use of a shock indicator in products can help in root cause analysis of failed parts.

Ball Shear/Pull Testing Ball shear testers are employed to quantify the strength of the interface between a solder ball and its package prior to second-level attach Ball shear experiments can also be employed to assess the solder ball-package pad interface qualitatively This is accomplished by assessing the failure mode observed during a ball shear experiment However, certain failure modes are a function of the speed of the test The failure modes observed at relatively low speeds (00001 to 00006 m/sec) are different from those observed at high speeds (001 to 10 m/sec) In general, solder shear strength tends to increase with shear speed It is therefore important that failure mode characterization as a function of shear speed be performed before this technique can be used effectively as an inline monitoring tool to control the quality of substrate lots.

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light up LED B2 rjmp get_t not_0: cpi r18, $01 ;check if the number in r18 is 1 brne not_1 ldi r18, 0b11111101 ;yes, so light up B1 and B3 out PORTB, r18 rjmp get_t not_1: cpi r18, $02 ;check if it is 2 brne not_2 ;no it is not ldi r18, 0b11111100 ;yes, it is.

To address this, JEDEC has published a revised version of the standard ball shear test to include high speed shear testing procedures (JESD22-B117A42) In addition to speed, a number of other factors could impact the fracture strength of solder joints, including surface finish, pad size, ball diameter, ball metallurgy, and pad construction All these need to be taken into account when comparing ball shear data across different packages Another important factor that could impact the force-to-failure and the failure modes induced is the time after reflow It is preferable to perform the test as early as possible after reflow43 In addition to the high-speed shear/pull test, other methodologies are also being explored to characterize the interface strength of solder joints One is a Charpy impact type of test44 This involves impacting the ball with a pendulum.

The amount of energy imparted into the ball is estimated and the failure modes as a function of impact toughness are catalogued This test is a sort of mini-shock test designed to produce an effect comparable to the high-speed shear test Another methodology is the use of a hot pin pull test in which a heated pin is inserted into the solder ball, cooled, and then pulled at high speed Efforts are being made to measure the force to cause failure, so that pull/shear force or impact energy could be used as a metric to assess the strength or weakness of a joint 59341 Effect of Lead-Free Conversion Depending on the surface finish, the intermetallics formed in SnAgCu solders are different from those formed in Pb/Sn joints Refer to Sec 60311 in Chap 60 for more details.

cutting takes place as a result of the relative velocity between the tool and the workpiece, it does not matter whether the tool is stationary and the workpiece is moving (turning), the workpiece is stationary and the cutting edge is moving (drilling), or a combination of the two as shown in Figure 31 (milling, although the work piece velocity is usually very small compared to the cutting edge velocity) [1]

Preliminary results on high-speed pull/shear testing of SnAgCu joints indicate a higher interfacial fracture rate than Pb/Sn joint However, the SnAgCu joints exhibited moderately higher fracture strength43.

FINITE ELEMENT ANALYSIS (FEA)

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