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FIGURE 59.15 FEA flowchart. Phase 1 involves creating the global model to determine global strains and displacements across the entire package. The global model also helps identify the locations of maximum stress. Phase 2 entails zooming into the location with the maximum strain. The boundary conditions applied around the local model are extracted from the global model. Phase 3 involves applying thermal cycling loads on the local model and determining the fatigue life of the worst-case solder joint in the local model. Phase 4 entails the use of statistical assessment tools to determine the reliability of the other solder joints relative to the worst case and thus estimating the solder joint reliability of the entire package.

is typically based on a maximum stress or strain in the solder joints. It is essential to obtain the displacements of the worst-case joint because those displacements can now be incorporated in a local model that will simulate multiple thermal cycles on a worst-case joint. Only a unit temperature rise is applied to the global model to reduce the computational run time. An additional assumption employed in global models to reduce run time is that all materials are linear-elastic and temperature-independent. Because the goal of the global model is to determine the worst-case joint and the corresponding displacement, this approach is typically valid. Reference 46 contains a series of experimental cases and corresponding FEA predictions that validate the global/local approach and the linear elastic, temperatureindependent unit temperature rise technique for the packages studied. 59.4.1.2 Phase 2: Local Model. A local model of the worst-case joint is created and subjected to simultaneous temperature cycle and temperature-scaled displacement-loading conditions obtained from the global model. The displacement field of the worst-case joint obtained

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FIGURE 59.16 Global FEA model of one-eighth of a BGA. Note the PWB, package substrate, die, and overmold are all created by a series of elements.

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in the global model when subjected to a unit temperature rise is scaled to match the expected displacement when the local model is subjected to actual thermal cycles. The advantage of this approach is that the local model can incorporate time and temperature material dependence because a reduced number of elements are employed when compared to the global model. A local model of a solder joint can be found in Fig. 59.17. The local model is subjected to multiple thermal cycles and a final damage parameter is extracted. A typical thermal cycling loading profile to which the model is subjected is similar to that shown in Fig. 59.3. About two to four cycles are run to achieve stability of the hysteresis loop.

Turning is a metal cutting process used for the generation of cylindrical surfaces Typically, the workpiece is rotated on a spindle, and the tool is fed into it radically, axially or both ways simultaneously to give the required surface The term turning , in the general sense, refers to the generation of any cylindrical surface with a single-point tool More specifically, it is often applied just to the generation of external cylindrical surfaces oriented primarily parallel to the workpiece axis The generation of surfaces oriented primarily perpendicular to the workpiece axis is called facing In turning, the direction

FIGURE 59.17 Close-up of three solder joints. The local model is created from one of the solder joints and its associated PWB, package substrate, die, and overmold. In this figure, the leftmost ball and associated material for the local model are indicated by the area inside the dashed rectangle.

Plastic work and plastic strain are two of the most common local damage parameters employed in solder joint lifetime estimations. The type of damage parameter selected is usually dictated by the experimental data available for a specific joint type (BGA, CCGA) that correlate damage with fatigue life. A methodology that employs plastic work and a correlation between plastic work and crack initiation and propagation can be found in References 10 and 46.

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